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24AA08/24LC08B
APPENDIX A:
REVISION HISTORY
Revision C (12/2003)
Corrections to Section 1.0, Electrical Characteristics.
Section 9.1, 24LC08B standard marking code.
Revision D (02/2005)
Added DFN package.
Revision E (09/2005)
Revised Figure 3-1: Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 7-
2 Random Read; Figure 7-3 Sequential Read; 8.3
Write-Protect (000-3FF).
Revision F (02/2007)
Updated Device Selection Table; Features section;
Changed 1.8V to 1.7V throughout document; Revised
Electrical Characteristics Ambient Temperature;
Replaced Package Drawings; Revised Product ID
System.
Revison G (02/2007)
Replaced Package Drawings.
Revision H (03/2008)
Added TDFN package.
Revision J (02/2009)
Moved Pin Descriptions to Section 2.0, renumbered
remaining sections. Added Figure 5-2.
Revision K (03/2012)
Added Chip Scale package; Revised Table 1-1, Table
2-1; Product ID System.
? 2002-2012 Microchip Technology Inc.
DS21710K-page 33
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